RECOMMENDED PROCESS FOR TELIC PHOTOMASK BLANKS

PROCESS FOR:  Gobo Blanks Coated with 3000Å Al & 5300Å AZ 1500 Photoresist

Process Step

Chemical

Process Parameter

Exposure

Broadband UV 25 mJ/cm²

7 sec.

Development

AZ 312 MIF

30 sec.

Rinse

DI Water

40 sec.

Etching

Cyantek AL-12S Aluminum Etch

7 min. 30 sec.

Rinse

DI Water

40 sec.

Resist Strip

Cyantek RS-120

5 min. @ 50° C

Final Clean

Cyantek Nanostrip

3 min.

Rinse

DI Water

40 sec.

 

PROCESS FOR:  Photomask Blanks Coated with 1000Å Low Reflective Chrome & 5300Å AZ 1500 Photoresist

Process Step

Chemical

Process Parameter

Exposure

Broadband UV 25 mJ/cm²

7 sec.

Development

AZ 312 MIF

30 sec.

Rinse

DI Water

40 sec.

Etching

MCT CEP-200 / Cyantek CR-9

60 sec.

Rinse

DI Water

40 sec.

Resist Strip

MCT PRS-100 / Cyantek RS-120

5 min. @ 50° C

Final Clean

Cyantek Nanostrip

3 min.

Rinse

DI Water

40 sec.

 

RECOMMENDED VENDORS FOR MASK PROCESSING CHEMISTRY

Microchrome Technology
1605  Remunda Lane
San Jose, CA 95112

Cyantek Corp.

3055 Osgood Court
Fremont, CA 94539

Tel: 408.452.5500

Fax: 408.452.5505

Tel: 510.651.3341
Fax: 510.651.3398

 

 

 

Telic Company
24832 Avenue Rockefeller
Valencia, CA 91355

Phone: 661.702.8603
Toll Free: (888) TELICCO
Fax: 661.257.6802
E-mail: telic2000@aol.com